re-do routing for lcd yet again
cuz im an idiot and thought that i could use via-in-pad i cant its $300 more if i do that so. pretty much all the connections on the mcu are gonna have to be on the top layer which will be. *fun*...
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a1909a0893
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3 changed files with 875 additions and 6016 deletions
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minic.kicad_pcb
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minic.kicad_pcb
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@ -1,6 +1,6 @@
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{
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"board": {
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"active_layer": 0,
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"active_layer": 4,
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"active_layer_preset": "",
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"auto_track_width": false,
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"hidden_netclasses": [],
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@ -135,10 +135,10 @@
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"min_silk_clearance": 0.0,
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"min_text_height": 0.8,
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"min_text_thickness": 0.08,
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"min_through_hole_diameter": 0.15,
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"min_through_hole_diameter": 0.2,
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"min_track_width": 0.0762,
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"min_via_annular_width": 0.2,
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"min_via_diameter": 0.35,
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"min_via_annular_width": 0.1,
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"min_via_diameter": 0.4,
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"solder_mask_to_copper_clearance": 0.0,
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"use_height_for_length_calcs": true
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},
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@ -226,8 +226,16 @@
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"drill": 0.0
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},
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{
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"diameter": 0.35,
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"drill": 0.25
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"diameter": 0.4,
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"drill": 0.3
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},
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{
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"diameter": 0.45,
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"drill": 0.2
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},
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{
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"diameter": 0.45,
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"drill": 0.3
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},
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{
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"diameter": 1.1,
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@ -496,8 +504,8 @@
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"priority": 2147483647,
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"schematic_color": "rgba(0, 0, 0, 0.000)",
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"track_width": 0.0889,
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"via_diameter": 0.35,
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"via_drill": 0.25,
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"via_diameter": 0.45,
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"via_drill": 0.3,
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"wire_width": 6
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}
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],
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